JT Professional PCB Reflow Oven Soldering Machine Tea-1000d – Xinling

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JT Professional PCB Reflow Oven Soldering Machine Tea-1000d – Xinling Detail:

Model X8-TEA-1000D
Machine parameters
Dimension(L*W*H) 6000*1660*1530mm
Weight Approx 2955kgs
Number of heating zone top 10/bottom 10
Length of heating zone 3895mm
Number of cooling zone top 3/bottom 3
Rectifying plate structure Small circulation
Exhaust volume requiement 10m³/min*2(Exhausts)
Color Computer grey
Control system
Power supply requiement 3 phase ,380v 50/60HZ(Option:3 phase ,220v 50/60HZ
Total power 83 KW
Startup power 38 KW
Normal power consumption 11 KW
Warming time Approx:20min
Temperature control range Room Temperature -300ºC
Temperature control method PID close loop control + SSR driving
Temperature control precision ±1ºC
Temperature deviation on PCB ±1.5ºC(by RM board test standard)
Data storage Process data and status storage
Abnormal alarm Abnormal temperature(extra-high/extra low temperature after constant temperature)
Board dropped alarm Singal light(yellow-warning;green normal;red -Abnormal
Conveyor system
Rails structure Overall sectional type
Chain structure Double buckle for preventing board jammed
Max width of PCB 400mm(option:460mm) dual-rail 300mm*2
Range of rail width 50-400mm(option:50-460mm) dual-rail 300mm*2
Component height Top 30/Bottom 30mm
Conveyor direction L→R(option:R→L)
Conveyor rail fixed type Front rail fixed(option: Rear rail fixed)
PCB conveyor direction Air-reflow=chain+mesh(N2-reflow=chain option:mesh)
Conveyor height 900±20mm
Conveyor speed 300-2000mm/min
Auto-lubrication Multi-lubricating mode can be chosen
Cooling system
Cooling method Firced air Water chiller

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